Keynote Lecture
| Toshiro Hiramoto | University of Tokyo, Japan |
| Evolutionary Trend of Silicon Nanoelectronics and Beyond CMOS Devices | |
Keynote at the Arranged Session - Fluctuation, DFM, FDC, and Uniformity of Dry Process -
| Richard Wise | IBM, U.S.A. |
| Etch Process Control for Advanced Logic Development | |
Surface Reactions
| Yasuhiro Oshima | Stanford Univ., U.S.A. |
| GeOxNy Interfacial Layer for High-k/Ge Gate stack: Chemical States and Electrical Correlations | |
Mechanism Studies, Diagnostics, and Simulations
| Erwin Kessels | TU/e, The Netherlands |
| Reaction mechanisms during plasma-assisted ALD of metals and high-k oxides | |
Dry Process for Low-k, High-k and New Materials
| Thierry Chevolleau | CNRS/LTM, France |
| Plasma Etching Challenges for Porous SiOCH Integration in Advanced Interconnect Levels | |
MEMS and TSV
| Fred Roozeboom | NXP Semiconductors, The Netherlands |
| 3D chip stacking technology to create cost-effective, manufacturable, stackable TSV interconnection processes (tentative) | |
FPD and Organic Devices
| Junichi Hanna | Tokyo Inst. Tech., Japan |
| Organic Semiconductor by Liquid Crystalline Molecules (tentative) | |